Title:
CLEANING METHOD FOR POLYIMIDE FILM FORMATION DEVICE
Document Type and Number:
Japanese Patent JP2015099808
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cleaning method for a polyimide film formation device capable of removing polyimide adhered to the inside of the device with ease.SOLUTION: A cleaning method for a polyimide film formation device of removing polyimide adhered to the inside of the device by a deposition step of depositing a polyimide film on a plurality of processing bodies housed in a reaction chamber, includes: a cleaning step of supplying oxygen into the reaction chamber and applying a high-frequency power to the inside of the reaction chamber to perform plasma excitation of oxygen, and making the plasma-excited oxygen be contacted with the polyimide adhered to the inside of the device to remove the polyimide.
Inventors:
HASHIMOTO HIROYUKI
TANAKA HIDEO
SHINNO REIJI
MATSUURA HIROYUKI
TANAKA HIDEO
SHINNO REIJI
MATSUURA HIROYUKI
Application Number:
JP2013237537A
Publication Date:
May 28, 2015
Filing Date:
November 18, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/31; H01L21/3065; H01L21/312
Domestic Patent References:
| JP2012209393A | 2012-10-25 | |||
| JPH11340204A | 1999-12-10 | |||
| JP2012209585A | 2012-10-25 | |||
| JPH0233153A | 1990-02-02 | |||
| JP2013247287A | 2013-12-09 | |||
| JP2000021866A | 2000-01-21 | |||
| JP2011176177A | 2011-09-08 | |||
| JPH08134666A | 1996-05-28 | |||
| JP2012238907A | 2012-12-06 |
Attorney, Agent or Firm:
Kimura Mitsuru