To provide a CMP equipment capable of CMP treatment of high performance and high reliability, a polishing method using the CMP equipment, and a manufacturing method of a semiconductor integrated circuit device.
In a CMP equipment, a waste liquid discharge vent 9 for detection is arranged in the middle part of a waste liquid discharge pipe 8 linked with a CMP process chamber 5 and a waste liquid treating function part 7, and a waste liquid detecting sensor 10 is attached to the waste liquid discharge vent 9 for detection. In a polishing method using the CMP equipment, an insulating film or a metal layer in a wafer 1 is polished, and the work finishing of CMP treatment of the insulating film or the metal layer is judged by using the waste liquid detecting sensor 10.
ITO HIDEFUMI
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