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Title:
COAT-FILM FORMING APPARATUS, COAT-FILM FORMING METHOD AND COMPUTER PROGRAM
Document Type and Number:
Japanese Patent JP2006218408
Kind Code:
A
Abstract:

To provide a cheap coat-film forming apparatus which facilitates the installation and arrangement of a sensor to a coating nozzle and collision of the coating nozzle and a substrate can be prevented.

A resist-film forming apparatus 10 comprises a loading table 11 of the substrate G, a resist nozzle 12, a horizontal driving mechanism 14 and a elevation mechanism 15 for moving the nozzle 12, a sensor array 20 equipped with an optical sensor 21 for detecting a change of a nozzle gap, a sub-controlling part 60 wherein an output signal is alloted to a standard output signal each of the sensor 21 at the time when the nozzle 12 is arranged at a discharge starting position of a resist liquid and the change of the gap is observed from a difference of the standard output signal and a signal from each sensor 21 when the resist liquid is discharged on the substrate G to form a resist film, and a main controlling part 50 wherein operation of the nozzle 12 is controlled so that a signal about the change of the gap from the sub-controlling part 60 is took in to prevent contact of the nozzle 12 and the substrate G.


Inventors:
OTSUKA KEISUU
NAKAMITSU TAKASHI
MIYAZAKI KAZUHITO
KAWAGUCHI YOSHIHIRO
Application Number:
JP2005034634A
Publication Date:
August 24, 2006
Filing Date:
February 10, 2005
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B05C5/02; B05D3/00; G01B11/14; G03F7/16; H01L21/027
Domestic Patent References:
JPH11165111A1999-06-22
JP2002001195A2002-01-08
JP2003347190A2003-12-05
JP2004283645A2004-10-14
JP2000131016A2000-05-12
JPH10421A1998-01-06
JP2000024571A2000-01-25
JP2002153795A2002-05-28
Attorney, Agent or Firm:
Hiroshi Takayama