To provide conductive paste having superior solder resistance and coated conductor powder for constituting the paste.

Because silver particles are coated with a coating film, including both a first metal component with sintering-restraining actions and a second metal component with sintering-accelerating actions, reactivity of mutual silver particles are reduced by the first metal component, while the reactivity of the mutual silver particles are enhanced by the second metal component. Therefore, as to a conductor film formed by using such coated silver powder, its soldering resistance is enhanced by the first metal component and also, lowering of a sintering property of the coated silver powder accompanied by addition of the first metal component is moderated by the second metal component. Accordingly, the coating film can be thickened, while the sintering properties of the silver powder sufficiently are high.