To enable a change in coating width of an adhesive without stopping a machine by using a die coating method for extruding the adhesive through a T-die.

A film substrate is coated with an adhesive by using a die coating method for extruding the adhesive through a slot of a T-die and then coating the surface of the film substrate therewith. The coating width of the adhesive can freely be regulated with deckles additionally installed at both ends of the T-die. A laminating apparatus for laminating at least the two film substrates can be employed by using the coating method to automatically change the substrate width and coating amount of the adhesive. Thereby, the continuous operation can be performed.