PURPOSE: To set conditions to be obtained for coating flattening liquidlike agent and cleaning to remove its peripheral edge independently from one another.

CONSTITUTION: A coating stage 2 and a cleaning stage 3 are individually provided. A conveyor 4, a hot plate 5 for baking flattening liquidlike agent, a loader 1 and an unloader 6 are disposed near it. The stage 2 has a vacuum chuck for sucking a wafer by rotating it by a spin motor, a coating cup opened at its upper part to surround the wafer, and a nozzle for dropping the agent above a central part of the wafer. The stage 3 similarly has them, but is different from the stage 2 at points in which an inner periphery of a cleaning cup is wider than that of the coating cup and a nozzle for discharging solvent is disposed above a peripheral edge of the wafer.