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Patent Searching and Data


Title:
COATING FILM FORMING METHOD AND COATING FILM FORMED ARTICLE
Document Type and Number:
Japanese Patent JP2004089754
Kind Code:
A
Abstract:

To provide a coating film forming method for uniformly coating an optional substrate with an optional coating solution while finely controlling the film thickness abnormal part of an edge, for example, the position or height of an edge bead in order to realize necessary flatness.

In the coating film forming method for spreading and fixing the coating solution on a support to form a coating film, a substance imparting surface tension having a surface tension value equal to or less than that of the coating solution before spreading is added to the coating solution being in contact with the support during or after the spreading of the coating solution. In this case, the substance to be added does not contains a component not contained in the coating solution before spreading and the boiling point thereof is below that of at least one component in the components of the coating solution. After the added substance is added to the coating film during or after spreading, the coating film is heated to the boiling point of the added substance or higher.


Inventors:
MIDORIKAWA MASAKO
MIURA NAOKO
Application Number:
JP2002250748A
Publication Date:
March 25, 2004
Filing Date:
August 29, 2002
Export Citation:
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Assignee:
CANON KK
International Classes:
G03F7/16; B05D3/00; B05D3/10; H01L21/027; (IPC1-7): B05D3/00; B05D3/10; G03F7/16; H01L21/027
Attorney, Agent or Firm:
Ryoichi Yamashita