Title:
COATING PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP3166064
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable improving maintenance performance of coating liquid and forming coating films different in thikness of a large caliber object to be treated.
SOLUTION: A resist liquid supply nozzle 23 supplying resist liquid A to the surface of a semiconductor wafer W which is rotated and held by a spin chuck 22, and a resist tank 25 as a resist liquid supply source are connected by using a supply tube path 24. A high viscosity adjustment equipment 26 as a viscosity adjustment means for adjusting the viscosity of the resist liquid A is interposed in the supply tube path. Then the resist liquid A can be adjusted to be a specified viscosity by the high viscosity adjustment equipment 26 and is supplied to the surface of the semiconductor wafer W. The coating film thickness can be made a specified value.
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Inventors:
Kazutoshi Yoshioka
Nobuo Konishi
Takayuki Toshima
Nobuo Konishi
Takayuki Toshima
Application Number:
JP4207996A
Publication Date:
May 14, 2001
Filing Date:
February 05, 1996
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/16; B05C11/08; H01L21/027; (IPC1-7): H01L21/027; B05C11/08; G03F7/16
Domestic Patent References:
| JP63161453A | ||||
| JP4130505A | ||||
| JP8203804A | ||||
| JP9213608A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto