PURPOSE: To prevent the deterioration with time of wiring material by a method wherein the surface of the conductor material, which is arranged in a substrate, is coated with the material having relatively low reactivity with environment.
CONSTITUTION: A two-layer structure wiring, in which a Cu layer 2 and an Au layer l are buried, is formed on the substrate 4 of an insulator or a semiconductor, the outside of the conductor material of this electric circuit wiring is brought into contact with the solution formed by adding and mixing a complexing agent and a reducing agent to NiSO4-6H2O, a electroless plating is conducted, and an Ni-B alloy 3 is deposited on the Ag layer 1. As a result, the surface of the conductor of the electric circuit wiring material can be suppressed its reacting with environment and also the movement of its constituent diffusion can be suppressed. As a result, the deterioration with time of the electric circuit can be suppressed or prevented.
KOGURE NAOAKI
INOUE HIROAKI
