PURPOSE: To eliminate the generation of an unnecessary inductance component in a coil-containing ceramic multilayer substrate by laminating a low temperature sintered insulator sheet formed with a coil pattern on its surface on an intermediate layer, and laminating a low temperature sintered insulator sheet formed with a conductor pattern for mounting other electronic components on its surface on an uppermost layer.
CONSTITUTION: A coil pattern 8a made of Ag, Ag-Pd, Cu is formed on the surface of a low temperature sintered magnetic sheet 8 laminated on a low temperature sintered insulator sheet 7. A low temperature sintered insulator sheet 9 is formed on its surface with a coil pattern 9a, and a low temperature insulator sheet 10 is formed on its surface with a coil pattern 10a of the state that a coil pattern 9a is rotated at 180°. The sheets 9, 10 are alternately laminated on the sheet 10. Two through holes 11a, 11b are formed at a low temperature sintered insulator sheet 11 laminated on the sheet 10 laminated on the uppermost layer, a conductor pattern 11c for mounting other electronic components is formed, a predetermined pressure is applied and baked.
SUGO KIMIHIDE
TSUKAMOTO WAKICHI
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