Title:
低温結合電子接着剤
Document Type and Number:
Japanese Patent JP2010539293
Kind Code:
A
Abstract:
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.
Inventors:
Larson, Eric G.
Zenner, Robert El. Dee.
Murray, Cameron Tea.
Sura, Rabi K.
Zenner, Robert El. Dee.
Murray, Cameron Tea.
Sura, Rabi K.
Application Number:
JP2010524941A
Publication Date:
December 16, 2010
Filing Date:
September 09, 2008
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J179/08; C09J4/00; C09J7/00; C09J7/02; C09J9/02; C09J11/06; C09J201/00; H01L21/60
Domestic Patent References:
| JP2000044905A | 2000-02-15 | |||
| JPH10147762A | 1998-06-02 | |||
| JPH10195403A | 1998-07-28 | |||
| JP2006257208A | 2006-09-28 | |||
| JP2006045459A | 2006-02-16 | |||
| JPH1112555A | 1999-01-19 | |||
| JPH11100558A | 1999-04-13 | |||
| JPH04115407A | 1992-04-16 |
Foreign References:
| US20040225059A1 | 2004-11-11 | |||
| WO2007046189A1 | 2007-04-26 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Satoshi Deno
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Satoshi Deno