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Patent Searching and Data


Title:
低温結合電子接着剤
Document Type and Number:
Japanese Patent JP2010539293
Kind Code:
A
Abstract:
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.

Inventors:
Larson, Eric G.
Zenner, Robert El. Dee.
Murray, Cameron Tea.
Sura, Rabi K.
Application Number:
JP2010524941A
Publication Date:
December 16, 2010
Filing Date:
September 09, 2008
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J179/08; C09J4/00; C09J7/00; C09J7/02; C09J9/02; C09J11/06; C09J201/00; H01L21/60
Domestic Patent References:
JP2000044905A2000-02-15
JPH10147762A1998-06-02
JPH10195403A1998-07-28
JP2006257208A2006-09-28
JP2006045459A2006-02-16
JPH1112555A1999-01-19
JPH11100558A1999-04-13
JPH04115407A1992-04-16
Foreign References:
US20040225059A12004-11-11
WO2007046189A12007-04-26
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Satoshi Deno