Title:
集合基板及びその製造方法
Document Type and Number:
Japanese Patent JP7380681
Kind Code:
B2
Abstract:
[Problem] To reduce the burden on a cutting tool such as a router used for cutting when cutting out assemblies including a plurality of individual substrates from an assembly substrate. [Solution] An assembly substrate 10 including a plurality of individual substrates 100 in the planar direction, wherein the assembly substrate 10 is provided with: a plurality of electronic components 130 embedded in the substrate so as to be respectively allocated to the individual substrates 100; a first frame body 11 disposed so as to surround the outer periphery of assemblies 20 including a plurality of the individual substrates 100; and a second frame body 12 disposed on the inside of the first frame body 11 so as to surround the outer periphery of the assemblies 20.
Inventors:
Yoshihiro Suzuki
Tsuyoshi Mochizuki
Hiroshige Ohkawa
Tsuyoshi Mochizuki
Hiroshige Ohkawa
Application Number:
JP2021515950A
Publication Date:
November 15, 2023
Filing Date:
April 06, 2020
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H05K3/00; H05K1/02
Domestic Patent References:
| JP201546450A | ||||
| JP2013149874A | ||||
| JP415266U | ||||
| JP2003347452A | ||||
| JP200463803A | ||||
| JP2004146766A | ||||
| JP2005159183A | ||||
| JP200932823A | ||||
| JP2009218240A | ||||
| JP2009289848A |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese