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Title:
COLLOIDAL-PARTICLE-CONTAINING EPOXY RESIN ORGANIC SOLVENT SOLUTION, PREPARATION OF SAME, AND CURABLE RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
Japanese Patent JP2000109648
Kind Code:
A
Abstract:

To obtain an organic solvent solution useful to obtain a curable composition having excellent curability and developing excellent hardness when cured by radically copolymerizing polymerizable-unsaturation-containing inorganic oxide colloidal particles dispersed in an organic solvent with a polymerizable- unsaturation-containing epoxy compound in the presence of an onium compound.

This solution is prepared by radically copolymerizing polymerizable-unsaturation-containing inorganic oxide colloidal particles (e.g. particles obtained by reacting colloidal silica with γ- methacryloxypropylmethoxysilane) dispersed in an organic solvent (e.g. xylene/n- butanol mixed solvent) with a polymerizable-unsaturation-containing epoxy compound (e.g. 3,4-epoxycyclohexylmethyl acrylate) in the presence of an onium compound being substantially inert to epoxy groups and desirably represented by formula I or II. In the formulae, Y is N or P; Ra to Rd are each H or a 12C or lower organic group; and X- is an anion, desirably, a halide ion.


Inventors:
OBATA SEIJI
AIDA AKIHIKO
WADA SEIJI
Application Number:
JP28629998A
Publication Date:
April 18, 2000
Filing Date:
October 08, 1998
Export Citation:
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Assignee:
KANSAI PAINT CO LTD
International Classes:
C08K5/19; C08K5/36; C08K5/50; C08L43/04; C08L63/00; C09D163/00; (IPC1-7): C08L63/00; C08K5/19; C08K5/36; C08K5/50; C08L43/04; C09D163/00