Title:
COMBINED MULTICHIP MODULE
Document Type and Number:
Japanese Patent JPH06232335
Kind Code:
A
Abstract:
PURPOSE: To provide an improvement in an integrated-circuit connecting system, including an MCM. CONSTITUTION: A plurality of normalized substrate modules are manufactured. A module includes pins, provided on its one surface for insertion into a socket and also includes substrate-side pads, provided on another surface and connected to the pins through conductors arranged within the module. Next, a custom IC module is manufactured on the substrate module. The IC module includes IC pads on its outer surface to be connected to the substrate-side pads through internal mutual connections provided within the IC module. An integrated circuit(IC) is welded to the IC pads.
Inventors:
HARORUDO ESU KURAAFUTSU
GEARI AARU SOONBAAGU
GEARI AARU SOONBAAGU
Application Number:
JP34726593A
Publication Date:
August 19, 1994
Filing Date:
December 27, 1993
Export Citation:
Assignee:
NCR INT INC
International Classes:
H01L25/18; H01L23/498; H01L25/10; H01L25/11; H05K1/00; H05K1/14; H05K3/46; (IPC1-7): H01L25/10; H01L25/11; H01L25/18
Attorney, Agent or Firm:
Yoshiaki Nishiyama
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