To positively prevent a component from being broken by setting the proper speed of collision, in an automatic electronic component attaching device which repeats the process of moving an electronic component held by itself toward a printed board by driving a motor, and mounting the electronic component on the printed board.
In order to suppress impact to a value lower than a predetermined value by controlling the speed of collision of an electronic component when colliding with the surface of a substrate, impact generated by an actual mounting operation is measured by a pressure sensor 6, the relationship between the speed of collision and the impact is analyzed from the data on measurements, and the subsequent speed, i.e., the driving speed of a motor is decided based on the relationship.
SAKAGUCHI AKIRA
Next Patent: METHOD FOR MOUNTING ELECTRONIC COMPONENT