Title:
部品実装装置および補正値管理方法
Document Type and Number:
Japanese Patent JP7340085
Kind Code:
B2
Abstract:
A component mounting device that performs mounting processing for mounting a component on a board based on a production program, includes: a storage section configured to store information; a setting section configured to set a correction value related to a mounting position of the component included in the production program; a storage control section configured to make the storage section store date and time information on which calibration related to the mounting processing is executed when the calibration is executed, and to make the storage section store the correction value in association with latest date and time information of the calibration when the correction value is set; and a correction section configured to perform a correction related to the mounting position using the correction value corresponding to the latest date and time information of the calibration without using the correction value not corresponding to the latest date and time information.
Inventors:
Daigo Kondo
Application Number:
JP2022205049A
Publication Date:
September 06, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP2018113337A | ||||
| JP20152230A | ||||
| JP2017194921A |
Foreign References:
| WO2017072887A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation ITEC International Patent Office