Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2023110635
Kind Code:
A
Abstract:
To provide a component mounting device capable of suppressing deterioration in correction accuracy of a mounting head in the XY position due to thermal expansion of a base.SOLUTION: The component mounting device includes: a mounting head capable of moving relative to a base which picks up a component from a component supply unit provided on a base side and mounts the component onto a substrate; a substrate transfer unit for transferring the substrate; a mark placement unit provided on the base including a pair of mark placement members having multiple marks arranged at predetermined intervals in the substrate transfer direction; an imaging unit provided on the mounting head to capture images of the marks; a control unit that calculates the position deviation of the mounting head based on the images captured by the imaging unit; and a suspension member that suspends the pair of mark placement members.SELECTED DRAWING: Figure 1
Inventors:
HIRAKI TSUTOMU
Application Number:
JP2022012212A
Publication Date:
August 09, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K13/04; H05K13/08
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office