Title:
部品実装装置
Document Type and Number:
Japanese Patent JP6577475
Kind Code:
B2
Abstract:
A control device (70) for a component mounting device (11) determines whether a specific part on an upper surface of a component accommodated on tape fed by a feeder (58) has been correctly recognized or not on the basis of an image captured by a marker camera (34) and controls a mounting head (24) and X axis and Y axis sliders (26, 30) on the basis of the results of that determination. Specifically, the control device (70) carries out control such that, for a good component for which the specific part can be correctly recognized, the good component is picked up by suction by a nozzle (40), transported to a prescribed position on a substrate (12) which is held by a support plate (20) and a support pen (23), and then released so as to be mounted on the substrate (12). Meanwhile, the control device (70) carries out control such that, for a bad component for which the specific part cannot be correctly confirmed, the bad component is picked up by suction by the nozzle (40), transported to a disposal box (68), and then released for disposal in the disposal box (68).
Inventors:
Kohei Sugihara
Fushiya Daisuke
Fushiya Daisuke
Application Number:
JP2016546216A
Publication Date:
September 18, 2019
Filing Date:
September 02, 2014
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/02; H05K13/04; H05K13/08
Domestic Patent References:
| JP2000106498A | ||||
| JP2012248626A | ||||
| JP7045998A | ||||
| JP2009117780A | ||||
| JP2015126216A | ||||
| JP201034376A |
Attorney, Agent or Firm:
Aitec International Patent Office