Title:
COMPONENT MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP3413746
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component mounting structure by which a removal operation is easy by a method in which the bonding piece of a component to be mounted is installed in a position separated at a prescribed interval from the surface of a board.
SOLUTION: A shielding case 1 is provided with bonding pieces 1b which are cut and erected from upper edges of cutout parts 1a formed in proper places in the bottom part. The bonding pieces 1b are arranged so as to be aligned with positions of grounding patterns 2a on the surface of a printed-wiring board 2, and they are soldered and bonded. The bonding pieces 1b are designed to be bent in such a way that they are separated and levitated by a prescribed interval D from the surface when the shielding case 1 is placed on the surface of the board 2. When they are soldered and bonded, solder bridges the bonding pieces 1b and grounding patterns 2a. Thereby, when it is required to remove the shielding case 1 from the printed-wiring board 3 for a later repair operation or the like after a face mounting operation by a soldering and bonding operation, the solder can be removed by using a solder gobbler or the like, and the shielding case 1 can be removed easily.
Inventors:
Takehiro Ito
Kazushi Sakai
Kazushi Sakai
Application Number:
JP3013496A
Publication Date:
June 09, 2003
Filing Date:
January 25, 1996
Export Citation:
Assignee:
Kenwood Corporation
International Classes:
H05K3/34; H05K7/08; H05K7/12; H05K7/14; H05K9/00; (IPC1-7): H05K7/12; H05K3/34
Domestic Patent References:
| JP1140694A | ||||
| JP6315094U | ||||
| JP236216Y2 |
Attorney, Agent or Firm:
Shuji Watanabe (1 person outside)