To solve the problem that the yields of electronic components are greatly lowered because of rejects due to short circuit caused by a metallic component penetrated into a ceramic sheet.
The composite ceramic sheet is produced by filling the voids of a ceramic sheet comprising a first ceramic powder and a first organic substance and having voids in its inside with ceramic slurry comprising a second ceramic powder and a second organic substance. The method for producing a ceramic electronic component comprises using the composite ceramic sheet. If the composite ceramic sheet is printed with a metallic paste thereon, the sheet can resist to the penetration of the metallic component thereinto. Therefore, rejects due to short circuit can be greatly reduced in ceramic electronic components using the composite ceramic sheet.
KURAMITSU HIDENORI
KOMATSU KAZUHIRO
Tomoyasu Sakaguchi
Hiroki Naito
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