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Title:
COMPOSITE DIELECTRIC, COMPOSITE DIELECTRIC SHEET, COMPOSITE DIELECTRIC PASTE, COMPOSITE DIELECTRIC SHEET WITH METALLIC LAYER, WIRING BOARD, AND MULTILAYER WIRING BOARD
Document Type and Number:
Japanese Patent JP2005029700
Kind Code:
A
Abstract:

To provide a composite dielectric having not only excellent dielectric characteristics in a high-frequency region but also characteristics of high heat resistance and low water absorption, and being easily formed into a thin substrate; and to provide a composite dielectric sheet, a wiring board and a multilayer wiring board.

The composite dielectric contains an aromatic liquid crystalline polyester, and a dielectric ceramic powder compounded in the aromatic liquid crystalline polyester, and has >650 Q-value at 1 GHz by a vibration method. The wiring board having the composite dielectric sheet comprising the composite dielectric having the characteristics has a small transmission loss because of a high dielectric constant and a low dielectric loss tangent, and is suitably usable for electronic equipment driven in the high-frequency region.


Inventors:
KAWABATA KENICHI
MORITA TAKAAKI
Application Number:
JP2003271145A
Publication Date:
February 03, 2005
Filing Date:
July 04, 2003
Export Citation:
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Assignee:
TDK CORP
International Classes:
C08L67/03; B32B18/00; C04B35/468; C04B35/50; C08G63/60; C08K3/22; C09K19/02; C09K19/38; G03C1/85; H05K1/03; H05K3/20; H05K3/46; (IPC1-7): C08L67/03; C08G63/60; C08K3/22
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Toyotaka Abe