Title:
COMPOSITE DIELECTRIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2005126700
Kind Code:
A
Abstract:
To provide a composite dielectric substrate capable of exhibiting characteristics inherent in a filler to the maximum possible extent, for example, capable of obtaining a high dielectric constant, when the filler having the high dielectric constant is used.
This composite dielectric substrate contains the filler comprising a ceramic dielectric powder and a matrix comprising a resin material in which the filler is dispersed, wherein the filler has first and second peaks in its particle size distribution, so that the first peak exists in a range of 0.1-1.0 μm and the second peak is larger than the first peak.
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Inventors:
TAKATANI MINORU
KOSARA HISASHI
UEMATSU HIROYUKI
NIMATA YOSUKE
KOSARA HISASHI
UEMATSU HIROYUKI
NIMATA YOSUKE
Application Number:
JP2004285387A
Publication Date:
May 19, 2005
Filing Date:
September 29, 2004
Export Citation:
Assignee:
TDK CORP
International Classes:
C08L101/00; C08K3/18; H01B3/00; (IPC1-7): C08L101/00; C08K3/18; H01B3/00
Attorney, Agent or Firm:
Mitsuru Oba