Title:
COMPOSITE ELECTRONIC PARTS AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPS5472956
Kind Code:
A
Abstract:
PURPOSE: To improve the efficiency of operations with the separation of electronic parts, by inserting the sealing part of the electronic parts into a resin case and then meking them in one.
CONSTITUTION: Electronic parts 13 and 14 include sealing parts 15 and 16 and led- out leads 17 to 22, and sealing parts 15 and 16 are inserted into resin case 23 thermally contractible, which is made to contract by being heat-treated, thereby covering sealing parts 15 and 16 hermetically into one.
Inventors:
TAIRA YASUO
INOMATA FUJIHIKO
MEGURO MASAO
INOMATA FUJIHIKO
MEGURO MASAO
Application Number:
JP13999777A
Publication Date:
June 11, 1979
Filing Date:
November 24, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L25/18; H01L23/00; H01L25/10; H01L25/11; H01L29/00; (IPC1-7): H01L23/00; H01L25/10; H01L29/00
Domestic Patent References:
| JPS4933752B1 | 1974-09-09 | |||
| JP52166458B |