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Title:
COMPOSITE FILM FOR COVERING PACKAGE
Document Type and Number:
Japanese Patent JPS54127486
Kind Code:
A
Abstract:

PURPOSE: Composite films for covering package that are prepared by using rigid polyvinyl chloride, polystyrene, polycarbonate or polyester as layers other than the sealing one, thus reducing curl at the sealded part.

CONSTITUTION: Rigid polyvinyl chloride, polystyrene, polycarbonate, or polyester of 15W40 micron thickness is used for layers other than sealing one in composite films and the thickness of the sealing layer is made to less than 40 microns. Above rigid polyvinyl chloride, polystyrene, polycarbonate, and polester are superior in nerve among thermoplastic resins even when the films are relatively thin and resist curling at the part to be sealed in deep drawn package. Less than 15 microns in film thickness reduces the resistance to curling and exceeding 40 microns also does not develop the effect, thus 15W40 microns is suitalbe.


Inventors:
YOSHIDA KAZUHIRO
KUROKI TAKESHI
Application Number:
JP3490478A
Publication Date:
October 03, 1979
Filing Date:
March 28, 1978
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B32B27/30; B32B27/36; B65B47/00; B65B65/04; (IPC1-7): B32B27/30; B32B27/36; B65B65/04
Domestic Patent References:
JPS4910720A1974-01-30
JPS5023078A1975-03-12
JPS4812883A



 
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