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Patent Searching and Data


Title:
COMPOSITE HEAT INSULATION PLATE
Document Type and Number:
Japanese Patent JPH10102612
Kind Code:
A
Abstract:

To contrive improvement in performance by using a laminated plate integrally arranging a heat insulator between laminated material composed of a bamboo material layer and a wood layer as bed material, the heat insulator, structural material and the like.

A composite heat insulation plate A is constituted to a heat insulator integrally arranged between surface material 1 and rear face material 2 composed of a laminated body laminating bamboo material and wood of one layer or more. With regard to bamboo material, for instance, China- produced thick stemmed bamboo is longitudinally divided, cut and manufactured into a flat plate by utilizing temperature, steam, an electromagnetic wave process, a press and the like, the plate is stuck to are another in the width direction, and is formed into a wide long flat plate. Synthetic resin such as polyurethane, inorganic monomer such as glass wool, a composite body or a mixture is used as the heat insulator 3. Thereby lightweight can be performed, mechanical strength can be significantly improved, if used as structural material, building cost can be reduced, watertightness, anti-corrosion, insect proofness and the like of bamboo material can be utilized, and furthermore, since bamboo grows quickly, resource can be prevented from being exhausted.


Inventors:
HOSHIKAWA TAKAHIRO
UMETSU HIROYUKI
TAKIGUCHI HIDEKI
Application Number:
JP25841996A
Publication Date:
April 21, 1998
Filing Date:
September 30, 1996
Export Citation:
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Assignee:
IG TECH RES INC
International Classes:
B27J1/00; B27M3/00; B32B21/08; E04B1/80; E04C2/24; (IPC1-7): E04B1/80; B27J1/00; B27M3/00; B32B21/08; E04C2/24