COMPOSITE INTEGRATED CIRCUIT PARTS

Title:

COMPOSITE INTEGRATED CIRCUIT PARTS

Document Type and Number:

Japanese Patent JPH0745786

Kind Code:

A

Abstract:

PURPOSE: To provide a composite integrated circuit parts wherein a ceramic substrate is used and a thin-film integrated circuit element having a good characteristic is obtained.

CONSTITUTION: In a composite integrated circuit part, on a ceramic substrate 101 whereon a thin-film integrated circuit 103 is formed, a layered type capacitor 106, a layered type inductor 107 and resistors are provided respectively, or a layered body composed of the capacitor 106, the inductor 107 and the resistors is provided. In this composite integrated circuit part, a glass layer 102 having a silicon oxide as its main component is formed in between the ceramic substrate 101 and the thin-film integrated circuit 103, and thereby, the irregularity of the surface of the ceramic substrate 101 is made flat.

Inventors:

ARAI MICHIO
NAGANO KATSUTO
YAMAUCHI YUKIO
SAKAMOTO NAOYA

Application Number:

JP19129993A

Publication Date:

February 14, 1995

Filing Date:

August 02, 1993

Export Citation:

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Assignee:

TDK CORP
SEMICONDUCTOR ENERGY LAB

International Classes:

H01G4/33; H01L21/316; H01L27/00; H01L27/12; H05K3/38; H05K3/46; (IPC1-7): H01L27/00; H01G4/33; H01L21/316; H01L27/12; H05K3/38; H05K3/46

Attorney, Agent or Firm:

Akira Yamatani (1 person outside)

Next Patent: THIN-FILM COMPOSITE INTEGRATED CIRCUIT PARTS AND ITS MENUFACTURE