PURPOSE: To restrain that a metal such as Cu, Zn or the like and a low-resistance oxide such as Cu2O, Zn2O or the like are precipitated locally at the bonding interface between a ceramic magnetic layer and a ceramic dielectric layer and to obtain a composite laminated component whose circuit resistance is high by a method wherein, after the bonding interface between the ceramic magnetic layer and the ceramic dielectric layer has been formed to be a recessed and protruding shape, the layers are fired.

CONSTITUTION: A capacitor chip body 2 constituted by laminating ceramic dielectric layers 21 and internal electrode layers 25 and an inductor chip body 3 constituted by laminating ceramic magnetic layers 31 and internal conductors 35 are united; external electrodes 51 are formed on the surface. Thereby, an LC composite component 1 is formed. At this time, the surface closest to the side of the capacitor chip body 2 out of the ceramic magnetic layers 31 and/or the surface closest to the side of the inductor chip body 3 out of the ceramic dielectric layers 21 are formed so as to be recessed and protruding; after that, the component is fired. Thereby, it is possible to restrain that Cu or Cu oxide and Zn or a Zn oxide or the like are precipitated locally at their interface, and it is possible to prevent that a layer whose electric resistance is low is formed.