COMPOSITE MATERIAL AND LAMINATED MATERIAL

Japanese Patent JPH02202520

A

PURPOSE:To obtain a laminated material suitable for printed circuit board, etc., having high heat-resistance and low permitting by impregnating a specific curable polyphenylene ether resin in a substrate, curing the resin, laminating a metallic foil to the resultant cured polyphenylene ether resin composite material and hot-pressing the laminate. CONSTITUTION:The objective laminated material is produced by impregnating a substrate with a curable polyphenylene ether resin having an average substitution rate of alkenyl group and alkynyl group of >=0.1mol% and a viscosity number of 0.2-1.0 and expressed by the structural formula I {J' is group of formula II [R1, R2, R3 and R4 are H, alkenyl group of formula III (R5, R6 and R7 are H or methyl; l is 1-4) or alkynyl group of formula IV (R8 is H, methyl, etc.; k is 1-4)]; Q' is H, polyfunctional phenolic compound residue having 2-6 phenolic hydroxyl groups and a polymerization inactive substituent at the o- and p-positions relative to the phenolic hydroxyl groups, etc.; m is 1-6}, curing the impregnated material, laminating a metallic foil to the obtained composite material and hot-pressing the laminate.

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KATAYOSE TERUO
WATANABE TAKAYASU

JP1973689A

August 10, 1990

January 31, 1989

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ASAHI CHEMICAL IND

B32B15/08; B29B11/16; C08G65/48; H05K1/03; (IPC1-7): B29B11/16; B32B15/08; C08G65/48

Nozaki

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