Title:
複合材料および放熱部品
Document Type and Number:
Japanese Patent JP7440944
Kind Code:
B2
Abstract:
The present invention relates to a composite material and a heat dissipation part composed of the composite material, wherein particles composed of a material having excellent thermal conductivity properties, such as diamond or silicon carbide (SiC), are composited in a metal matrix to implement excellent thermal conductivity, and at the same time, to control a thermal expansion coefficient to be in a desired range, and particularly, even if high heat is applied, the thermal conductivity is hardly degraded.
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Inventors:
Cho, Myung-fan
Lee, Suk-u
Kim, Yong-Suk
Lee, Suk-u
Kim, Yong-Suk
Application Number:
JP2022069318A
Publication Date:
February 29, 2024
Filing Date:
April 20, 2022
Export Citation:
Assignee:
The Good System Corporation
International Classes:
H01L23/373; B32B15/01; C22C5/06; C22C5/08; C22C9/00; C22C9/01; C22C21/00; C22C21/06; C22C21/12; C22C23/00; C22C23/02; C22C26/00; C22C29/06; C22C30/00; C22C30/02; H01L23/36
Domestic Patent References:
| JP2018111883A | ||||
| JP9312362A | ||||
| JP2017095766A | ||||
| JP2005175006A | ||||
| JP11067991A |
Foreign References:
| WO2016035796A1 | ||||
| WO2019163721A1 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK