Title:
COMPOSITE METERIAL FOR PACKAGE
Document Type and Number:
Japanese Patent JP3021817
Kind Code:
B2
Abstract:
PURPOSE: To provide the cheap composite material for package whose treatment after use is easy, while it has the barrier properties of high grade and the excellent sweet smell-keeping property for its contact.
CONSTITUTION: The outer layer containing a board is laminated on the surface of the silicon oxide-film layer of the deposited film in which silicon oxide-film layer with a thickness of 10-300nm is provided on one surface of the film made of specified polyester resin. Accordingly, the laminate has the gas barrier properties of high grade, excellent sweet smell-keeping property and sufficient heat seal strength, and is cheap, and them its incinerating treatment after use is simple.
Inventors:
Shinichi Ohashi
Shigenobu Yoshida
Youzo Ogawa
Shigenobu Yoshida
Youzo Ogawa
Application Number:
JP21380291A
Publication Date:
March 15, 2000
Filing Date:
August 26, 1991
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
B32B7/02; B32B7/10; B32B9/00; B32B27/36; B32B29/00; C23C14/10; (IPC1-7): B32B9/00; B32B7/10; B32B27/36; B32B29/00
Domestic Patent References:
| JP63281838A |
Attorney, Agent or Firm:
Koji Hasegawa
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