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Patent Searching and Data


Title:
COMPOSITE MOLDING
Document Type and Number:
Japanese Patent JP2011178127
Kind Code:
A
Abstract:

To inhibit large deformation when laminating and integrating a laminated material consisting of BMC or SMC to a base material consisting of a molding of a polynorbornene-based resin.

When the degree of contraction corresponding to the linear expansion coefficient of the base material 4 is set to X, and the degree of contraction which takes place to the laminated material 5 when molding by laminating the laminated material 5 to the base material 4 is set to Y, the degree Y of the contraction when molding the laminated material 5 is set so that Y/X may become at least 0.75 and at most 1.25.


Inventors:
HARUMIYA KAZUFUMI
Application Number:
JP2010046948A
Publication Date:
September 15, 2011
Filing Date:
March 03, 2010
Export Citation:
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Assignee:
DAIKYONISHIKAWA CORP
International Classes:
B32B27/00; B29C43/18; B32B5/28; B29K105/06
Domestic Patent References:
JP2002167447A2002-06-11
JPH08318588A1996-12-03
JP2004209917A2004-07-29
JP2002067229A2002-03-05
JP2009202444A2009-09-10
JPH09174781A1997-07-08
JP2009202444A2009-09-10
JP2006175757A2006-07-06
JP2001172400A2001-06-26
JP2002167447A2002-06-11
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura