Title:
COMPOSITE MOLDING
Document Type and Number:
Japanese Patent JP2011178127
Kind Code:
A
Abstract:
To inhibit large deformation when laminating and integrating a laminated material consisting of BMC or SMC to a base material consisting of a molding of a polynorbornene-based resin.
When the degree of contraction corresponding to the linear expansion coefficient of the base material 4 is set to X, and the degree of contraction which takes place to the laminated material 5 when molding by laminating the laminated material 5 to the base material 4 is set to Y, the degree Y of the contraction when molding the laminated material 5 is set so that Y/X may become at least 0.75 and at most 1.25.
Inventors:
HARUMIYA KAZUFUMI
Application Number:
JP2010046948A
Publication Date:
September 15, 2011
Filing Date:
March 03, 2010
Export Citation:
Assignee:
DAIKYONISHIKAWA CORP
International Classes:
B32B27/00; B29C43/18; B32B5/28; B29K105/06
Domestic Patent References:
JP2002167447A | 2002-06-11 | |||
JPH08318588A | 1996-12-03 | |||
JP2004209917A | 2004-07-29 | |||
JP2002067229A | 2002-03-05 | |||
JP2009202444A | 2009-09-10 | |||
JPH09174781A | 1997-07-08 | |||
JP2009202444A | 2009-09-10 | |||
JP2006175757A | 2006-07-06 | |||
JP2001172400A | 2001-06-26 | |||
JP2002167447A | 2002-06-11 |
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura