Title:
COMPOSITE PARTICLE AND SEMICONDUCTOR SEALING MATERIAL
Document Type and Number:
Japanese Patent JP2014196541
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide composite particles usable for a cosmetic, a perfumery, a coating, an ink, a phosphor, a battery material, an electronic material or the like, and having a homogeneous shell structure with an excellent dispersion state of an individual coated particle.SOLUTION: In a composite particle of this invention, which is a composite particle having a base material and a coating layer for coating the base material, the coating layer is constituted of a plurality of particles, and when the friction angle of the particle to the base material is expressed as A and the friction angle between particles is expressed as B, inequality A≥B is satisfied.
Inventors:
NAKANO SHOGO
Application Number:
JP2013073134A
Publication Date:
October 16, 2014
Filing Date:
March 29, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C23C30/00
Domestic Patent References:
| JP2012052090A | 2012-03-15 | |||
| JP2014195780A | 2014-10-16 |