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Title:
COMPOSITE PLATED MATERIAL WITH DISPERSED PARTICLES, METHOD FOR MANUFACTURING THE SAME, AND PLATING SOLUTION FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014201779
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a composite plated material capable of increasing an eutectoid ratio of fine particles into a plating coating irrespective of the kind of a plating bath; and a method for manufacturing the composite plated material.SOLUTION: A composite plated material includes: a conductive base material; and a composite plating layer that includes fine particles having a functional group to be ionized in a plating solution and an ionic surfactant having an electric charge opposite to the charge of the fine particles in the plating solution.

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Inventors:
KITAGAWA SHUICHI
FUJII SHIGETO
KOBAYASHI YOSHIAKI
ITAGAKI MASAYUKI
SHITANDA ISAO
Application Number:
JP2013077123A
Publication Date:
October 27, 2014
Filing Date:
April 02, 2013
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
UNIV OF SCIENCE TOKYO
International Classes:
C25D15/02; C10M101/02; C10M105/12; C10M105/14; C10M105/18; C10M105/24; C10M105/32; C10M129/34; C10M133/04; C10M133/10; C10M139/02; C10M159/06
Domestic Patent References:
JP2011149071A2011-08-04
JPH02305997A1990-12-19
JPH06330392A1994-11-29
Foreign References:
WO2012067202A12012-05-24
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae



 
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