Title:
COMPOSITE PLATING DEVICE
Document Type and Number:
Japanese Patent JP3516288
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To evenly enhance the wear resistance of a composite plating film by uniformly co-depositing ceramic particles into a metallic matrix of the composite plating film.
SOLUTION: A cylindrical electrode 4 is arranged by opening a clearance in a hollow part 3. This cylindrical electrode 4 is provided with through-holes 26 at the peripheral wall which is formed in the bore gradually smaller or larger toward the front end from the base end of the cylindrical electrode 4 and faces the hollow part 3. Then, the composite plating liquid 5 advancing to the inner side of the cylindrical electrode 4 is made into a turbulent state and the SIC particles 32 in the composite plating liquid 5 are evenly dispersed. This composite plating liquid 5 is injected through the through-holes 26 into the hollow part 3 and, 2 thereafter, the SiC particles 32 are evenly codeposited in the metallic matrix of the hollow part 3.
Inventors:
Ishigami, Osamu
Ogawa, Yoshimitsu
Ishikawa, Makoto
Ogawa, Yoshimitsu
Ishikawa, Makoto
Application Number:
JP29260396A
Publication Date:
April 05, 2004
Filing Date:
November 05, 1996
Export Citation:
Assignee:
HONDA MOTOR CO LTD
International Classes:
C25D5/00; C25D7/00; C25D15/02; (IPC1-7): C25D15/02
Attorney, Agent or Firm:
下田 容一郎
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