Title:
複合めっき材料とそれを用いた電気・電子部品
Document Type and Number:
Japanese Patent JP5654015
Kind Code:
B2
Abstract:
A composite plating material that comprises the following: at least one base plating layer (2), on a conductive substrate (1), that comprises copper, nickel, cobalt, iron, or an alloy that contains at least one of said elements; and a surface plating layer (4), on top of the base plating layer(s), that comprises silver, a silver alloy, tin, or a tin alloy. Tiny hollow particles (5) that enclose at least one chemical selected from a group comprising lubricants, anti-sulfuration agents, anti-rust agents, and anti-discoloration agents exist inside and/or on the surface of the surface plating layer. Said tiny hollow particles (5) constitute 0.1% to 30% of the volume of the surface plating layer (4), and 50% to 80% of said tiny hollow particles (5) lie between the surface of the surface plating layer (4) and the point halfway through the thickness thereof.
Inventors:
北河 秀一
藤井 恵人
平山 陽介
板垣 昌幸
四反田 功
藤井 恵人
平山 陽介
板垣 昌幸
四反田 功
Application Number:
JP2012524045A
Publication Date:
January 14, 2015
Filing Date:
November 17, 2011
Export Citation:
Assignee:
古河電気工業株式会社
International Classes:
C25D15/02; C25D5/10; C25D5/18; C25D7/00
Domestic Patent References:
| JPH08104997A | 1996-04-23 | |||
| JP2008248295A | 2008-10-16 | |||
| JP2008248294A | 2008-10-16 | |||
| JPH08311696A | 1996-11-26 | |||
| JP2001254195A | 2001-09-18 |
Other References:
JPN6013037048; 表面技術便覧 初版, 19980227, ２８０-２８１頁, 日刊工業新聞社
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae
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