金属結合モチーフを有する複合ポリペプチド及びそれを備える分子構築物

Title:

金属結合モチーフを有する複合ポリペプチド及びそれを備える分子構築物

Document Type and Number:

Japanese Patent JP7395200

Kind Code:

B2

Abstract:

Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.

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Inventors:

Chan, Tse Wen
Chu, Shin Mao
Tian, Way Ting
You, You Fusiang

Application Number:

JP2021556739A

Publication Date:

December 11, 2023

Filing Date:

March 25, 2020

Export Citation:

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Assignee:

Immunwork Inc.

International Classes:

C07K19/00; A61K47/64

Domestic Patent References:

JP2013513548A
JP2015205881A
JP2015513541A
JP2006223188A

Foreign References:

KR1020150122280A
WO2010065735A2
US20040034888
US20040123343
WO2018165619A1
WO2018166529A1
WO2017176007A1

Attorney, Agent or Firm:

Seiji Matsumoto

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