Title:
COMPOSITE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3957341
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the size and production cost by forming a conductive pattern on the surface of an insulation board such that the marginal part of the pattern is thinner than the central part thereof.
SOLUTION: A conductive pattern 20 is formed on the surface of an insulation board. A conductive pattern 21 for mounting electronic elements having large current capacities such as semiconductor chip is formed such that its marginal part 22 is thinner than its central part 23. A metal layer for fixing semiconductors to a heat sink is formed on the back face of the insulation board 1. Thus it is possible to reduce the size and production costs.
Inventors:
Fukuda Eigo
Akira Komiya
Mori Saburo
Akira Komiya
Mori Saburo
Application Number:
JP11948796A
Publication Date:
August 15, 2007
Filing Date:
April 18, 1996
Export Citation:
Assignee:
Nippon Inter Co., Ltd.
International Classes:
H01L23/14; H01L27/01; H01L25/07; H01L25/18; (IPC1-7): H01L27/01; H01L23/14; H01L25/07; H01L25/18
Domestic Patent References:
| JP5025397B2 | ||||
| JP2117156A |
Attorney, Agent or Firm:
Kozo Sakakibara
Previous Patent: INK JET PRINTER FOR ELECTRIC-FIELD MANIPULATION OF INK DROPS
Next Patent: MANUFACTURE OF CHARGING PLATE
Next Patent: MANUFACTURE OF CHARGING PLATE