To simultaneously satisfy the reduction of the thickness of an insulating layer and the increase of the thickness of a wiring conductor layer, and also to enable the accurate formation of functional ceramic parts such as a chip capacitor in a substrate.
An unbaked functional ceramic 12 is mounted on a light transmitting carrier film 10; a photosetting slurry at least containing a photosetting monomer, a photopolymerization initiator, and a ceramic material is coated on the carrier film 10 having the functional ceramic parts 12 formed thereon to have a thickness not smaller than the thickness of the functional ceramic 12, and to form a photosetting ceramic layer 13; and the carrier film 10 is irradiated with light from its back side to photoset a region of the film other than the formation of the functional ceramic parts 12. Thereafter, a non-photoset is melted and removed to prepare a composite sheet 'a' having the photosetting ceramic layer 13 and the functional ceramic 12. The sheet is stacked on another composite sheet similarly manufactured.
FUKAMIZU NORIMITSU
YAMAMOTO KOJI
IMOTO AKIRA
