Title:
COMPOSITE STRUCTURE AND METHOD OF FORMING SAME
Document Type and Number:
Japanese Patent JPS59145553
Kind Code:
A
Abstract:
A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.
Inventors:
JIYURIUSU SHII FUISUTAA
JIYON EFU BURIIDEISU
JIYON EFU BURIIDEISU
Application Number:
JP465584A
Publication Date:
August 21, 1984
Filing Date:
January 13, 1984
Export Citation:
Assignee:
OLIN MATHIESON
International Classes:
H05K3/34; B23K1/00; B23K35/00; B32B15/01; C22C9/00; C23C2/08; H01L23/14; H01L23/495; H01L23/50; (IPC1-7): B23K1/00; C22C9/06; C23C1/04; C25D3/30; H01L23/12; H01L23/48; H05K1/18
Domestic Patent References:
| JPS5315067A | 1978-02-10 | |||
| JPS5579849A | 1980-06-16 | |||
| JPS5362742A | 1978-06-05 |
Attorney, Agent or Firm:
Hideto Asamura