To simplify a manufacturing process and to improve dimensional accuracy and flatness in a composite wiring board obtained by combining a ceramic substrate and a resin layer.
The composite wiring board includes a ceramic substrate 1, a resin layer 3 provided in contact with at least one of the surfaces of the ceramic substrate 1, and a sintered metal conductor 6 penetrating the resin layer 3. The method of manufacturing the composite board includes the step of obtaining a conductor forming sheet by charging conductive paste into a through-hole formed on a sheet having a shrinkage suppressing effect, the step of obtaining the ceramic substrate having the sintered metal conductor on the surface by firing the conductor forming sheet and a substrate green sheet which are superimposed on each other, the step of removing the fired sheet having the shrinkage suppressing effect from the surface of the ceramic substrate, and the step of forming the resin layer on the surface of the ceramic substrate. The sheet having the shrinkage suppressing effect can be a green sheet for suppressing shrinkage or a sheet containing calcium carbonate.
COPYRIGHT: (C)2007,JPO&INPIT
MIYAKOSHI TOSHINOBU
KOSARA HISASHI
| JP2005223225A | 2005-08-18 | |||
| JP2005243704A | 2005-09-08 | |||
| JPH07235774A | 1995-09-05 | |||
| JPH03106061A | 1991-05-02 | |||
| JP2003198130A | 2003-07-11 | |||
| JPH0653655A | 1994-02-25 | |||
| JPH1075060A | 1998-03-17 | |||
| JP2000277914A | 2000-10-06 | |||
| JP2002290043A | 2002-10-04 | |||
| JPH06216524A | 1994-08-05 |
| WO1998047331A1 | 1998-10-22 |
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