Title:
Composition for acoustic wave probe, silicone resin for acoustic wave probe using the same, acoustic wave probe and ultrasonic probe, and acoustic wave measuring device, ultrasonic diagnostic device, photoacoustic wave measuring device and ultrasonic endoscope.
Document Type and Number:
Japanese Patent JP6366560
Kind Code:
B2
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Inventors:
Takayasu Nagai
Yoshihiro Nakai
Atsushi Osawa
Yoshihiro Nakai
Atsushi Osawa
Application Number:
JP2015218497A
Publication Date:
August 01, 2018
Filing Date:
November 06, 2015
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
A61B8/14; H04R17/00
Domestic Patent References:
| JP2009240782A | ||||
| JP8305375A | ||||
| JP2002095081A |
Foreign References:
| WO2012115139A1 | ||||
| US20070282204 |
Attorney, Agent or Firm:
Toshizo Iida
Shuichi Akabane
Shuichi Akabane