Title:
COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING COMPOSITION
Document Type and Number:
Japanese Patent JP2023058453
Kind Code:
A
Abstract:
To provide: a composition having excellent UV-laser workability; a circuit board; and a composition production method.SOLUTION: A composition contains a fluorine resin and a nitrogen-containing heterocyclic compound that reduces its weight by 1 mass% by thermal decomposition at a temperature of at least 330°C. The composition has a light absorbance of at least 0.6 for light having a wavelength of 355 nm.SELECTED DRAWING: None
Inventors:
SAWAKI KYOHEI
UEDA YUKI
OKUNO SHINGO
TATEMICHI MAYUKO
UEDA YUKI
OKUNO SHINGO
TATEMICHI MAYUKO
Application Number:
JP2022163014A
Publication Date:
April 25, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
DAIKIN IND LTD
International Classes:
C08L27/12; H05K1/03
Domestic Patent References:
| JPH11199738A | 1999-07-27 | |||
| JP2004175983A | 2004-06-24 | |||
| JP2009126962A | 2009-06-11 | |||
| JP2018039916A | 2018-03-15 | |||
| JP2019199576A | 2019-11-21 | |||
| JPH04503081A | 1992-06-04 |
Foreign References:
| CN106009430A | 2016-10-12 | |||
| WO2020090607A1 | 2020-05-07 | |||
| WO2018221643A1 | 2018-12-06 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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