Title:
COMPOSITION FOR FORMING FILM
Document Type and Number:
Japanese Patent JP2007177042
Kind Code:
A
Abstract:
To obtain an insulating film having excellent film properties such as dielectric constant, metal diffusion barrier property, etc., and a composition for forming a film for obtaining an electronic device using the insulating film.
The composition for a forming film comprises a polymer of a compound represented by general formula (I) (Q is a group containing a ring structure composed of carbon atoms or a group containing a basket structure composed of carbon atoms; l is an integer of 1-10; m is an integer of 0-10; n is an integer of 1-10; X is an arbitrary substituent group; Y is a group containing a carbon-carbon unsaturated bond; R is a group containing a functional group containing atoms such as O, N, S, P, etc.).
Inventors:
MORITA KENSUKE
ADEGAWA YUTAKA
ADEGAWA YUTAKA
Application Number:
JP2005375703A
Publication Date:
July 12, 2007
Filing Date:
December 27, 2005
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C08L101/00; C07C63/36; C07C63/49; C07C215/74; C07C233/07; C07C233/25; C07C233/58; C07C233/65; C07C233/75; C07C235/56; C07C313/04; C07C321/22; C07C323/20; C07C335/16; C07F7/10; C07F9/38; C07F9/48; C07F9/50; C08F38/00; H01L21/312; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa
Previous Patent: THERMOSETTING POLYMER
Next Patent: POLYURETHANE RESIN FORMING COMPOSITION, SEALING MATERIAL AND HOLLOW FIBER MEMBRANE MODULE
Next Patent: POLYURETHANE RESIN FORMING COMPOSITION, SEALING MATERIAL AND HOLLOW FIBER MEMBRANE MODULE