COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE

Title:

COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE

Document Type and Number:

Japanese Patent JP2010053292

Kind Code:

A

Abstract:

To provide a composition for forming an insulating film which can form a film having a low dielectric constant and high heat-resistance, the insulating film obtained by using the composition for forming the insulating film, a method for manufacturing the insulating film using the composition for forming the insulating film, and an electronic device having the insulating film as a layer-constituting layer.

The composition for forming the insulating film contains a polymer having a repeating unit expressed by general formula (1) (wherein, X expresses a cage structure, Y expresses an aromatic hydrocarbon group, R1 expresses an alkyl group, R2 expresses a substituent, (a) expresses an integer of 1-18, b expresses an integer of 0-6, and * expresses a bonding position).

Inventors:

ARAYAMA KYOHEI
WADA KENJI
INABE HARUKI

Application Number:

JP2008221821A

Publication Date:

March 11, 2010

Filing Date:

August 29, 2008

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

C08G61/02; H01L21/312; H01L21/768; H01L23/522

Attorney, Agent or Firm:

Nozomi Watanabe
Haruko Sanwa

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