Title:
リンドープ酸化錫導電膜形成用組成物及びリンドープ酸化錫導電膜
Document Type and Number:
Japanese Patent JP6530673
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a phosphorous-doped tin oxide conductive film capable of suppressing the increase of the surface resistivity of a phosphorous-doped tin oxide conductive film under high temperature-high moisture and under ultraviolet irradiation and forming a phosphorous-doped tin oxide conductive film excellent in adhesion to a base material and combining satisfactory conductivity, transparency and light resistance, and a phosphorous-doped tin oxide conductive film.SOLUTION: Provided is a composition containing phosphorous-doped tin oxide grains, a binder resin and an organic solvent, in the composition, the phosphorous-doped tin oxide grains are included by 3 to 45 mass%, and, in the solid contents of the composition, the components other than the phosphorous-doped tin oxide grains are included by 10 to 52 mass%. The phosphorous-doped tin oxide grains have a specific surface area by a BET method of 75 to 110 m/g and an L value of 45 to 65, and the binder resin includes ethyl cellulose and a terpene phenol resin having a softening point of 130 to 160°C. The phosphorous-doped tin oxide conductive film is obtained by uniformly dispersing the phosphorous-doped tin oxide grains having the specific surface area by a BET method and the prescribed L value into the terpene phenol resin having the softening point, and, in the film, the phosphorous-doped tin oxide grains are included by 48 to 90 mass%, and the components other than the phosphorous-doped tin oxide grains are included by 10 to 52 mass%.SELECTED DRAWING: None
Inventors:
Shinya Shiraishi
Umeda Hirotoshi
Umeda Hirotoshi
Application Number:
JP2015155989A
Publication Date:
June 12, 2019
Filing Date:
August 06, 2015
Export Citation:
Assignee:
Mitsubishi Materials Electronic Chemicals Co., Ltd.
International Classes:
H01B1/20; C08K3/22; C08K5/13; C08K5/3435; C08L1/28; C08L65/00; C09D5/24; C09D7/40; C09D101/08; C09D191/00; H01B1/00; H01B5/14
Domestic Patent References:
| JP2009018979A | ||||
| JP2006073836A |
Attorney, Agent or Firm:
Masayoshi Suda
Akira Murasawa
Akira Murasawa