Title:
熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
Document Type and Number:
Japanese Patent JP7183307
Kind Code:
B2
Abstract:
The present invention provides a composition for heat conductive materials, which enables the achievement of a heat conductive material that exhibits excellent heat conductivity. The present invention also provides: a heat conductive material which is formed from this composition for heat conductive materials; a heat conductive sheet; and a device with a heat conductive layer. A composition for heat conductive materials according to the present invention contains a phenolic compound, an epoxy compound and an inorganic substance, while satisfying at least one of the following requirements: the phenolic compound contains a spirophenol compound; and the epoxy compound contains a spiroepoxy compound.
Inventors:
Seiichi Hitomi
Daisuke Hayashi
Keita Takahashi
Teruki Arai
Daisuke Hayashi
Keita Takahashi
Teruki Arai
Application Number:
JP2020569565A
Publication Date:
December 05, 2022
Filing Date:
January 23, 2020
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C08L63/00; C08G59/20; C08G59/62; C08K3/00; H01L23/36
Domestic Patent References:
| JP2017036423A | ||||
| JP2015168782A | ||||
| JP2016089072A | ||||
| JP2018467A | ||||
| JP2016069549A | ||||
| JP10060091A | ||||
| JP7292073A | ||||
| JP2002511874A |
Foreign References:
| US20160081188 |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi
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