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Patent Searching and Data


Title:
COMPOSITION FOR INJECTION MOLDING OF CERAMIC
Document Type and Number:
Japanese Patent JPH11278915
Kind Code:
A
Abstract:

To shorten the degreasing time of a formed molded product by including a thermoplastic resin, a plasticizer and a specific amount of a wax therein.

For example, waxes such as a petroleum-based, a synthetic or a vegetable wax are cited as a wax and the melting point thereof is preferably ≤100°C. The wax in an amount of 15-70 pts.wt. based on 100 pts.wt. of a composition for injection molding of a ceramic is contained therein. An acrylic resin and an ethylene-vinyl acetate copolymer are cited as a thermoplastic resin and the resins are more preferably used in combination. In this case, the amounts thereof compounded based on 100 pts.wt. of the composition for the injection molding of the ceramic are preferably 10-75 pts.wt. of the acrylic resin and 2-15 pts.wt. of the ethylene-vinyl acetate copolymer. A plasticizer is preferably a phthalic ester-based one and is preferably compounded in an amount of 1-15 pts.wt. based on 100 pts.wt. of the composition for the injection molding of the ceramic.


Inventors:
MURATA KAZUYA
KITAMURA TAKESHI
SAITO MITSUHIRO
Application Number:
JP7821698A
Publication Date:
October 12, 1999
Filing Date:
March 26, 1998
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
C04B35/00; B28B1/24; C04B35/632; (IPC1-7): C04B35/00; C04B35/632
Attorney, Agent or Firm:
Masaaki Koshiba (1 outside)