Title:
組成物、硬化膜の製造方法、硬化膜付き部材、電子・電気部品、および部材の製造方法
Document Type and Number:
Japanese Patent JP6733261
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composition capable of enhancing designability of an electric and electronic device.SOLUTION: There is provided a composition containing polyester amide acid (A), an epoxy compound (B), an epoxy curing agent (C), a coloring material (D) and a solvent (E), wherein the coloring material (D) has a solid component (D1) which is insoluble to the solvent (E), the solid component (D1) is constituted by a material ensuring that brightness L* and chroma saturation C* of a cured film with thickness of 4 to 6 μm formed from the composition is lower than brightness L* and chroma saturation C* of a standard cured film with thickness of 4 to 6 μm formed from a standard composition obtained by removing the coloring agent (D) from the composition providing the cured film and a ratio RWof content of the solid component (D1) Wto content of solid component other than the solid component (D1) Wis 5% to 50%.SELECTED DRAWING: Figure 1
Inventors:
Yoshihiro Deyama
Moritakoshi Shinta
Setsuo Itami
Moritakoshi Shinta
Setsuo Itami
Application Number:
JP2016069052A
Publication Date:
July 29, 2020
Filing Date:
March 30, 2016
Export Citation:
Assignee:
JNC Corporation
International Classes:
C09D17/00; C08G59/52; C09D7/61; C09D163/00; C09D177/12
Domestic Patent References:
| JP2009237030A | ||||
| JP5295320A | ||||
| JP2014005402A | ||||
| JP2009052023A | ||||
| JP2003253186A | ||||
| JP63175029A |
Attorney, Agent or Firm:
Katsuyuki Okubo
Ichiro Kaneko
Ichiro Kaneko