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Title:
COMPOSITION FOR METAL POLISHING
Document Type and Number:
Japanese Patent JP2007207785
Kind Code:
A
Abstract:

To provide a composition for metal polishing which can prevent the aggregation of abrasive grains caused by a polishing product during polishing, and can achieve a high polishing speed stably even if processes fluctuate.

The composition for metal polishing contains an oxidant and colloidal silica wherein at least part of silicon atoms on the surface are substituted with aluminum atoms. It is preferred that the primary grain diameter of the colloidal silica is 10-60 nm, the content of the colloidal silica is 0.001-0.5 wt.%, and a polishing solution has a pH of 2-7.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
YAMASHITA KATSUHIRO
TAKENOUCHI KENJI
Application Number:
JP2006021511A
Publication Date:
August 16, 2007
Filing Date:
January 30, 2006
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H01L21/304; B24B37/00; B82Y10/00; B82Y99/00; C09K3/14
Domestic Patent References:
JP2003197573A2003-07-11
JP2003224092A2003-08-08
JP2005159269A2005-06-16
JP2005167204A2005-06-23
JP2005142542A2005-06-02
JP2008512871A2008-04-24
JP2002313759A2002-10-25
JP2004071673A2004-03-04
JP2004128475A2004-04-22
JP3337464A
Foreign References:
WO2004101221A22004-11-25
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda