Title:
COMPOSITION FOR MOISTUREPROOFING USE
Document Type and Number:
Japanese Patent JP3700037
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition exhibiting high moistureproofing performance comparable to polyethylene laminated paper, good in disaggregativeness between the resin layer and paper when recycled and in slip resistance, and free from wax's falling off, comprising paraffin wax and respectively specific other components.
SOLUTION: This composition for moistureproofing use comprises (A) pref. 3-95 pts.wt. of paraffin wax (pref. 50-70°C in melting point) and (B) pref. 50-97wt.% of an esterified product from maleinated or fumarated rosin and a polyhydric alcohol (pref. 100-150°C in softening point and ≤50 in acid value) and a hydrogenated product therefrom (pref. ≥70°C in softening point and ≤50 in acid value) and/or (C) a terpenephenol (pref. 100-150°C in softening point and 550-1,100 in number-average molecular weight, pref. a reaction product from β-pinene and phenolic resin) and a hydrogenated product from petroleum resin (pref. ≥70°C in softening point).
Inventors:
Kakinuma Chikao
Youichi Tode
Youichi Tode
Application Number:
JP25142996A
Publication Date:
September 28, 2005
Filing Date:
September 24, 1996
Export Citation:
Assignee:
Dainippon Ink and Chemicals Co., Ltd.
International Classes:
C08L57/02; C08L21/02; C08L61/04; C08L91/06; C08L93/04; C08L101/00; (IPC1-7): C08L91/06; C08L21/02; C08L57/02; C08L61/04; C08L93/04; C08L101/00
Domestic Patent References:
| JP57155254A |
Attorney, Agent or Firm:
Kono Tsuyo